Intel and AMD Microprocessors, Part 2 Codexery

Broadwell (microarchitecture)

Intel's 14 nm die shrink of Haswell, introducing Core M.

Broadwell (microarchitecture)

Andy Dingley · CC BY-SA 4.0

Broadwell, previously known by the codename Rockwell, is an x86-64 CPU microarchitecture from Intel. It represents the "tick" phase of Intel's tick–tock model, meaning it is a die shrink of the preceding Haswell architecture, built on a 14 nm FinFET manufacturing process. Products based on Broadwell are sold as fifth-generation Core processors, v4-suffixed Xeon chips, and certain Pentium and Celeron models. This microarchitecture also marks the debut of the Core M processor branding. Like some earlier tick–tock iterations, Broadwell did not entirely replace the full Haswell lineup; no low-end desktop CPUs were released under Broadwell.

Broadwell's H and C variants work with Intel's 9 Series chipsets (Z97, H97, and HM97) and also maintain backward compatibility with some 8 Series chipsets. The architecture includes a fully integrated voltage regulator, a feature shared with Haswell.

The design is split into several major variants. The BGA package includes Broadwell-Y, a system on a chip (SoC) with 4.5 W and 3.5 W thermal design power (TDP) classes, aimed at tablets and some ultrabooks. It uses a GT2 GPU and supports up to 8 GB of LPDDR3-1600 memory. These were the first Broadwell chips to launch, in late 2014, and were branded as Core M. TSX instructions are disabled in this series due to a bug that cannot be fixed via microcode update. Broadwell-U is also an SoC, with 15 W TDP for 2+2 and 2+3 configurations (two cores with GT2 or GT3 GPU) and 28 W for 2+3 configurations, designed for ultrabook and NUC platforms using the PCH-LP chipset. It supports up to 16 GB of DDR3 or LPDDR3 memory, with maximum speeds of DDR3-1600 and LPDDR3-1867. The 2+2 configuration was scheduled for late 2014, and the 2+3 for early 2015. For models with 5x00 GPUs, the die size is 82 mm² with 1.3 billion transistors; models with 6100 and 6200 GPUs have a 133 mm² die with 1.9 billion transistors. Broadwell-H comes in 37 W and 47 W TDP classes, for motherboards with HM86, HM87, QM87, and HM97 chipsets, targeting all-in-one systems, mini-ITX boards, and other small formats. It was expected in two variants: dual-chip (4 cores, 8 threads) with GT3e or GT2 GPU, and a single-chip SoC (2 cores, 4 threads) with GT3e GPU, supporting up to 32 GB of DDR3-1600 memory, scheduled for mid-2015.

Quick Facts

Produced-Start
October 27, 2014
Produced-End
November 2018
Cpuid
0306D4h
Code
80658 (mainstream desktop/mobile, Xeon E3) · 80660 (Xeon E5) · 80669 (Xeon E7) · 80671 (enthusiast desktop) · 80674 (Xeon D) · 80682 (Xeon D, Hewitt Lake)
Numcores
2–4 (mainstream) · 6–10 (enthusiast) · 4–24 (Xeon)
Gpu
HD 5300 · HD 5500 · HD 5700P · HD 6000 · HD 6100 · HD 6200 · HD 6300P · HD Graphics
Arch
x86-16, IA-32, x86-64
Microarch
Haswell

Facts from the source article.

Lore & Background

Broadwell was launched in three major BGA variants: Broadwell-Y (SoC, 4.5 W and 3.5 W TDP classes, for tablets and ultrabook-class implementations), Broadwell-U (SoC, 15 W and 28 W TDP classes, for ultrabook and NUC platforms), and Broadwell-H (37 W and 47 W TDP classes, for all-in-one systems and small footprint formats). Desktop variants included Broadwell-DT (quad-core unlocked with GT3e graphics and 128 MB eDRAM L4 cache, 65 W TDP, LGA 1150) and Broadwell-E (HEDT platform, LGA 2011-v3, released July 2016). Server variants included Broadwell-EP (Xeon E5-2600 v4, up to 22 cores, 55 MB cache) and Broadwell-EX (Brickland platform, up to 24 cores, 60 MB L3 cache).

Unusually for a tick, Broadwell introduced instruction set extensions: Intel ADX (ADOX and ADCX), RDSEED, PREFETCHW, SMAP, and Transactional Synchronization Extensions (except on Broadwell-Y due to a hardware bug). The GPU was upgraded to Gen 8, with up to 48 execution units, VP8 hardware decoding, HEVC hybrid decoding, and support for Direct3D 12, OpenGL 4.4, and OpenCL 2.0. The 90-series chipsets (H97 and Z97) added PCIe M.2 support. Broadwell's H and C variants work with Intel 9 Series chipsets and retain backward compatibility with some Intel 8 Series chipsets.

Reader's Guide

Broadwell's significance lies in its role as Intel's first 14 nm microarchitecture, delivering a die shrink of Haswell with improved power efficiency, particularly in mobile and ultra-low-power segments. The introduction of the Core M brand marked Intel's push into fanless, low-power designs for tablets and ultrabooks. However, Broadwell did not completely replace the full range of Haswell CPUs; there were no low-end desktop CPUs based on Broadwell, leaving traditional desktop users with no new socketed CPU options beyond fourth-generation Haswell until the summer of 2015. Even then, Intel launched its high-end sixth-generation Skylake CPUs very shortly after the two Broadwell desktop chips appeared. The microarchitecture's legacy includes the addition of several instruction set extensions (ADX, RDSEED, SMAP) and improved GPU capabilities, but its delayed rollout due to low yields from Intel's 14 nm process meant it served as a transitional architecture rather than a dominant one. Broadwell-E, released in 2016, brought Intel Turbo Boost Max Technology 3.0 to the enthusiast HEDT platform.

Did You Know?

Gallery

Frequently Asked Questions

What is Broadwell in Intel's lineup?

Broadwell is Intel's x86-64 microarchitecture that acts as the 14 nm die-shrink of Haswell within the tick-tock cadence. It was internally codenamed Rockwell and shipped to consumers as fifth-generation Core processors.

How does Broadwell differ from Haswell architecturally?

Broadwell is a process-node shrink rather than a new design, moving from 22 nm to 14 nm FinFET fabrication while keeping the Haswell core largely intact. Because of this, it never fully displaced the Haswell lineup, and both generations sold side by side.

Which product families are built on Broadwell?

Broadwell silicon powers fifth-generation Core desktop and mobile CPUs, v4-suffixed Xeon server chips, and select Pentium and Celeron parts. It also introduced the Core M brand aimed at ultra-thin, low-power laptops.

When did Broadwell first reach the market?

The initial Broadwell-Y parts launched in the third and fourth quarters of 2014. Desktop Broadwell-DT followed on the LGA 1150 socket.

Why is Broadwell considered a milestone for Intel?

It was the first Intel microarchitecture fabricated on the 14 nm FinFET node, a major step in transistor density and power efficiency. It also debuted the Core M branding, which targeted the fanless, thin-and-light laptop segment.

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